电磁驱动无阀并联微泵的设计与制作工艺

TH3; A parallel dynamic passive valveless micropump was designed, which consists of three layers-valve, diaphragm and electromagnetic coil. The valve was wetly etched in a silicon wafer, the diaphragm was a PDMS (polydimethyl siloxane) film spun on a silicon wafer with embedded permanent magnet post...

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Published in上海大学学报(英文版) Vol. 11; no. 1; pp. 79 - 83
Main Authors 苏宇锋, 陈文元, 崔峰, 张卫平
Format Journal Article
LanguageChinese
Published School of Mechanical Engineering, Zhengzhou University, Zhengzhou 450001, P. R. China%Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai 200030, P. R. China 2007
Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai 200030, P. R. China
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Summary:TH3; A parallel dynamic passive valveless micropump was designed, which consists of three layers-valve, diaphragm and electromagnetic coil. The valve was wetly etched in a silicon wafer, the diaphragm was a PDMS (polydimethyl siloxane) film spun on a silicon wafer with embedded permanent magnet posts, and the coil was electroplated on a silicon substrate. Under the actuation of the magnetic field generated by coils, the flexible diaphragm could be displaced upwards and downwards.After analyzing magnetic and mechanical characteristic of the flexible membrane and direction-dependence of the nozzle, a micropump was designed. And the relative length (L/d) of the micropump nozzle was taken 4. A 7 × 7 array of permanent magnetic posts was embedded in the PDMS film. Two diaphragms worked in an anti-step mode, which could relieve the liquid shock and increase the discharge of the micropump. The ANSYS(R) and Matlab(R) were adopted to analyze the actuation effect of the coil and the flow characteristic of the micropump
ISSN:1007-6417