Nanometer wire grid structure fabrication method

• Format: Patent
• Language: English
• Published: 14.07.2020

The present invention provides a nanometer wire grid structure fabrication method. The method first uses an imprinting mold to subject a thermoplastic base plate to hot pressing so as to form a plurality of recesses and a plurality of projections that are alternate with each other thereon, and then forms a metal film on the plurality of recesses and the plurality of projections, then uses a metal bonding adhesive material to transfer portions of the metal film located on the projections to a wire grid carrier board, and finally peeling off the thermoplastic base plate to obtain a nanometer wire grid structure, and compared to the prior art, the entire process is conducted in a manner of being free of photoresist coating, photoresist residue, and metal etching, so as to avoid problems of fabrication of the prior art caused by poor etching accuracy, difficulty of photoresist residue removal, and wire grid collapsing during etching operation and help simplify the fabrication process of a nanometer wire grid structure, shorten fabrication time of the nanometer wire grid structure, and improve fabrication efficiency and process yield of the nanometer wire grid structure.