Semiconductor device and display apparatus

In a COF of an embodiment of the present invention, the smaller distance to edges of a heat-releasing member an area of the heat-releasing member has, the larger openings the area has. Accordingly, a volume per area (an area per length) of the heat-releasing member decreases toward the edges. The ar...

Full description

Saved in:
Bibliographic Details
Main Authors Nakagawa, Tomokatsu, Chikawa, Yasunori, Rai, Akiteru, Katoh, Tatsuya, Sugiyama, Takuya
Format Patent
LanguageEnglish
Published 01.01.2013
Online AccessGet full text

Cover

More Information
Summary:In a COF of an embodiment of the present invention, the smaller distance to edges of a heat-releasing member an area of the heat-releasing member has, the larger openings the area has. Accordingly, a volume per area (an area per length) of the heat-releasing member decreases toward the edges. The arrangement improves flexibility of the COF. This prevents a stress caused by bending the COF from concentrating at the edges. This makes it possible to prevent a line on an insulating film from being broken. Also, it becomes possible to prevent an anisotropic conductive resin from coming off which is used to bond the COF with a display panel in providing the COF in a display apparatus.