Surface processing method for mounting stage

A surface processing method for a mounting stage, which enables a mounting surface conforming to a substrate to be formed while saving time and effort. The substrate is mounted on a mounting surface of the mounting stage disposed in a housing chamber of a substrate processing apparatus that carries...

Full description

Saved in:
Bibliographic Details
Main Authors Aoto, Tadashi, Kikuchi, Eiichiro, Higuma, Masakazu, Higuchi, Kimihiro
Format Patent
LanguageEnglish
Published 01.01.2013
Online AccessGet full text

Cover

More Information
Summary:A surface processing method for a mounting stage, which enables a mounting surface conforming to a substrate to be formed while saving time and effort. The substrate is mounted on a mounting surface of the mounting stage disposed in a housing chamber of a substrate processing apparatus that carries out plasma processing on the substrate. The mounted substrate is thermally expanded.