Stackable plasma cleaned via package and method

A method of forming a stackable plasma cleaned via package includes forming interconnection balls on terminals. The interconnection balls are encapsulated in a package body, e.g., molding compound. Via apertures are formed through the package body to expose the interconnection balls, wherein a conta...

Full description

Saved in:
Bibliographic Details
Main Authors Bancod, Ludovico E, Kim, Jin Seong, Wachtler, Kurt Peter
Format Patent
LanguageEnglish
Published 25.12.2012
Online AccessGet full text

Cover

More Information
Summary:A method of forming a stackable plasma cleaned via package includes forming interconnection balls on terminals. The interconnection balls are encapsulated in a package body, e.g., molding compound. Via apertures are formed through the package body to expose the interconnection balls, wherein a contamination is formed on the interconnection balls. The contamination is removed using a plasma cleaning process. By removing the contamination, robust reflow of the interconnection balls is insured thus maximizing yield. Further, the plasma cleaning process is a cost efficient high volume process with no adverse effect on package reliability.