Lead frame design to improve reliability

An electronic device package comprising a lead frame having at least one lead with a notch . The notch includes at least one reentrant angle of greater than 180 degrees and the notch is located distal to a cut end of the lead.

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Bibliographic Details
Main Authors Golick, Larry W, Low, Qwai Hoong, Osenbach, John W, Stahley, Matthew E
Format Patent
LanguageEnglish
Published 18.12.2012
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Summary:An electronic device package comprising a lead frame having at least one lead with a notch . The notch includes at least one reentrant angle of greater than 180 degrees and the notch is located distal to a cut end of the lead.