IC solder reflow method and materials
Embodiments of IC manufacture resulting in improved electromigration and gap-fill performance of interconnect conductors are described in this application. Reflow agent materials such as Sn, Al, Mn, Mg, Ag, Au, Zn, Zr, and In may be deposited on an IC substrate, allowing PVD depositing of a Cu layer...
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Main Author | |
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Format | Patent |
Language | English |
Published |
06.11.2012
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Online Access | Get full text |
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