IC solder reflow method and materials

Embodiments of IC manufacture resulting in improved electromigration and gap-fill performance of interconnect conductors are described in this application. Reflow agent materials such as Sn, Al, Mn, Mg, Ag, Au, Zn, Zr, and In may be deposited on an IC substrate, allowing PVD depositing of a Cu layer...

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Bibliographic Details
Main Author Lavoie, Adrien R
Format Patent
LanguageEnglish
Published 06.11.2012
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Summary:Embodiments of IC manufacture resulting in improved electromigration and gap-fill performance of interconnect conductors are described in this application. Reflow agent materials such as Sn, Al, Mn, Mg, Ag, Au, Zn, Zr, and In may be deposited on an IC substrate, allowing PVD depositing of a Cu layer for gap-fill of interconnect channels in the IC substrate. The Cu layer, along with reflow agent layer, may then be reflowed into the interconnect channels, forming a Cu alloy with improved gap-fill and electromigration performance. Other embodiments are also described.