Substrate dividing method
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate having a front face formed with functional devices with laser light while positioning a...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English |
| Published |
06.11.2012
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| Online Access | Get full text |
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| Summary: | A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate having a front face formed with functional devices with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate , and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face of the semiconductor substrate after the step of forming the starting point region for cutting such that the semiconductor substrate attains a predetermined thickness. |
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