Laser beam machining method

A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region formed by multiphoton absorption forms a cutting start region within an object to be processed along a line along which the object is intended to be cut. Thereafter, the ob...

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Bibliographic Details
Main Authors Fukuyo, Fumitsugu, Fukumitsu, Kenshi, Uchiyama, Naoki, Wakuda, Toshimitsu, Atsumi, Kazuhiro, Muramatsu, Kenichi
Format Patent
LanguageEnglish
Published 21.08.2012
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Summary:A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region formed by multiphoton absorption forms a cutting start region within an object to be processed along a line along which the object is intended to be cut. Thereafter, the object is irradiated with laser light L transmittable through an unmodified region of the object , so as to generate fractures from the cutting start region acting as a start point, whereby the object can accurately be cut along the line along which the object is intended to be cut. Expanding an expandable film having the object secured thereto separates individual chips from each other, which can further improve the reliability in cutting the object along the line along which the object is intended to be cut.