Package systems having a conductive element through a substrate thereof and manufacturing methods of the same

• Main Authors: Chu, Chia-Hua, Chang, Kuei-Sung, Lin, Chung-Hsien, Hung, Chia-Ming, Peng, Jung-Huei, Tsai, Yi Heng, Lee, Jiou-Kang
• Format: Patent
• Language: English
• Published: 31.07.2012

A package system includes a first substrate structure including at least one first conductive structure that is disposed over a first substrate. A second substrate structure includes a second substrate. The second substrate structure is bonded with the first substrate structure. The at least one fir...