Package systems having a conductive element through a substrate thereof and manufacturing methods of the same

A package system includes a first substrate structure including at least one first conductive structure that is disposed over a first substrate. A second substrate structure includes a second substrate. The second substrate structure is bonded with the first substrate structure. The at least one fir...

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Bibliographic Details
Main Authors Chu, Chia-Hua, Chang, Kuei-Sung, Lin, Chung-Hsien, Hung, Chia-Ming, Peng, Jung-Huei, Tsai, Yi Heng, Lee, Jiou-Kang
Format Patent
LanguageEnglish
Published 31.07.2012
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Summary:A package system includes a first substrate structure including at least one first conductive structure that is disposed over a first substrate. A second substrate structure includes a second substrate. The second substrate structure is bonded with the first substrate structure. The at least one first conductive structure is electrically coupled with the second substrate through at least one germanium-containing layer.