Embedding thin film resistors in substrates in power delivery networks

Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce c...

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Main Authors Myat, Myitzu Soe, Chang, Mooi Ling, Lee, Eu Soon, Min, Yongki, Wong, King Keong
Format Patent
LanguageEnglish
Published 24.07.2012
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Abstract Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples.
AbstractList Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples.
Author Lee, Eu Soon
Wong, King Keong
Myat, Myitzu Soe
Min, Yongki
Chang, Mooi Ling
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Snippet Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be...
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