Embedding thin film resistors in substrates in power delivery networks

Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce c...

Full description

Saved in:
Bibliographic Details
Main Authors Myat, Myitzu Soe, Chang, Mooi Ling, Lee, Eu Soon, Min, Yongki, Wong, King Keong
Format Patent
LanguageEnglish
Published 24.07.2012
Online AccessGet full text

Cover

More Information
Summary:Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples.