Analyzing apparatus, analyzing method, and computer-readable recording medium storing an analyzing program
An analyzing method includes acquiring displacements with respect to loads applied of the test piece measured by the three-point bending test; calculating a first approximate expression of a relation of the displacements with respect to the loads applied in a first area where the relation is linear...
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| Format | Patent |
| Language | English |
| Published |
19.06.2012
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| Online Access | Get full text |
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| Summary: | An analyzing method includes acquiring displacements with respect to loads applied of the test piece measured by the three-point bending test; calculating a first approximate expression of a relation of the displacements with respect to the loads applied in a first area where the relation is linear so as to determine an elasticity modulus of the test piece; extracting boundary value of a relation of strains caused by the displacements with respect to the loads so as to determine a yield stress value of the test piece; and calculating a second approximate expression of a relation of stress caused by the loads with respect to the strains caused by the displacements in a second area beyond the yield stress value on the basis of the yield stress value, the elasticity modulus, and the measurements in the second area. |
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