Circuit materials, circuits laminates, and method of manufacture thereof

A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70...

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Bibliographic Details
Main Authors Paul, Sankar K, Caisse, Christopher J, Baars, Dirk M, Horn, III, Allen F
Format Patent
LanguageEnglish
Published 29.05.2012
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Summary:A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.