Method of manufacturing a printed circuit board
A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board can include forming a first protective layer over one surface of a core substrate, forming a first circuit pattern over the other surface of the core s...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
22.05.2012
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| Online Access | Get full text |
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| Summary: | A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board can include forming a first protective layer over one surface of a core substrate, forming a first circuit pattern over the other surface of the core substrate by a first process, removing the first protective layer, forming a second protective layer over the other surface of the core substrate, and forming a second circuit pattern over the one surface of the core substrate by a second process. |
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