Techniques for forming solder bump interconnects

Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequentl...

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Bibliographic Details
Main Authors Dang, Bing, Gruber, Peter A, Guerin, Luc, Patel, Chirag S
Format Patent
LanguageEnglish
Published 03.04.2012
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Summary:Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequently attached to the attachment points of the wafer.