Manufacturing method for integrating a shunt resistor into a semiconductor package

An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a...

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Bibliographic Details
Main Authors Udompanyavit, Ubol, Koduri, Sreenivasan K, Steele, Gerald W, Cole, Jason M, Kummerl, Steven
Format Patent
LanguageEnglish
Published 06.03.2012
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Summary:An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.