Lead frame, lead frame fabrication, and semiconductor device
Lead frames and their fabricating method which reduce generation of defects in the process of fabricating semiconductor devices, in particular connection defects in wire bonding, thereby improving the product yield and reliability, and semiconductor devices using the lead frames and their fabricatin...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
28.02.2012
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| Online Access | Get full text |
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| Summary: | Lead frames and their fabricating method which reduce generation of defects in the process of fabricating semiconductor devices, in particular connection defects in wire bonding, thereby improving the product yield and reliability, and semiconductor devices using the lead frames and their fabricating method are provided. A method for fabricating a lead frame is characterized in including a process of forming a substrate equipped with a convex portion, and a metal layer having a first portion that overlaps a first surface included in the convex portion and a second portion that extends from the first portion and does not overlap the first surface, and a process of bending the metal layer such that the second portion of the metal layer overlaps a second surface included in the convex portion that intersects the first surface. |
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