Method for connecting a die attach pad to a lead frame and product thereof

• Main Authors: Almagro, Erwin Ian V, Granada, Jr, Honorio T, Calo, Paul Armand
• Format: Patent
• Language: English
• Published: 07.02.2012

Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads...