Method for connecting a die attach pad to a lead frame and product thereof

Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads...

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Bibliographic Details
Main Authors Almagro, Erwin Ian V, Granada, Jr, Honorio T, Calo, Paul Armand
Format Patent
LanguageEnglish
Published 07.02.2012
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Summary:Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.