Heater chips with silicon die bonded on silicon substrate

A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements...

Full description

Saved in:
Bibliographic Details
Main Authors Anderson, Frank Edward, Bernard, David Laurier, Dryer, Paul William, Joyner, II, Burton Lee, McNees, Andrew Lee, Strunk, Timothy Lowell, Sullivan, Carl Edmond
Format Patent
LanguageEnglish
Published 03.01.2012
Online AccessGet full text

Cover

More Information
Summary:A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si-O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.