Curing accelerator for epoxy resin composition, and one-pack type thermosetting epoxy resin composition
1 2 A curing accelerator for epoxy resin compositions, which is used in a one-pack type epoxy resin composition having excellent storage stability and rapid curability. The curing accelerator for epoxy resin compositions contains a microcapsule type curing accelerator wherein a compound represented...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
27.12.2011
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| Online Access | Get full text |
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| Summary: | 1 2 A curing accelerator for epoxy resin compositions, which is used in a one-pack type epoxy resin composition having excellent storage stability and rapid curability. The curing accelerator for epoxy resin compositions contains a microcapsule type curing accelerator wherein a compound represented by formula (I) is encapsulated by a thermosetting resin. (In formula (I), Rand Reach represents a hydrogen atom or an alkyl group.) |
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