Epoxy resin molding material for sealing and electronic component device

The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material fo...

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Bibliographic Details
Main Authors Hamada, Mitsuyoshi, Nagai, Akira, Ikeba, Hiroaki, Nanaumi, Ken, Yasuzawa, Kouhei
Format Patent
LanguageEnglish
Published 27.12.2011
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Summary:The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.