Polishing apparatus and polishing method

An apparatus polishes an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to b...

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Bibliographic Details
Main Authors Nakao, Hidetaka, Hayashi, Eisaku, Oishi, Kunio, Hayakawa, Isao, Miyake, Yoshiaki, Tateyama, Yoshikuni, Ashihara, Takeshi
Format Patent
LanguageEnglish
Published 13.12.2011
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Summary:An apparatus polishes an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.