Integrated circuit packaging system with exposed conductor and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a component connector on the substrate; forming a resist layer on the substrate with the component connector exposed; forming a vertical insertion cavity in the resist layer, the vertical inser...

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Bibliographic Details
Main Authors Yang, DeokKyung, Ahn, SeungYun
Format Patent
LanguageEnglish
Published 29.11.2011
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Summary:A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a component connector on the substrate; forming a resist layer on the substrate with the component connector exposed; forming a vertical insertion cavity in the resist layer, the vertical insertion cavity isolated from the component connector or a further vertical insertion cavity, the vertical insertion cavity having a cavity side that is orthogonal to the substrate; forming a rounded interconnect in the vertical insertion cavity, the rounded interconnect nonconformal to the vertical insertion cavity; and mounting an integrated circuit device on the component connector.