Methods of patterning insulating layers using etching techniques that compensate for etch rate variations

• Main Authors: Park, Wan-jae, Kumar, Kaushik Arun, Linville, Joseph Edward, Lisi, Anthony David, Srivastava, Ravi Prakash, Wendt, Hermann Willhelm
• Format: Patent
• Language: English
• Published: 15.11.2011

Methods of forming integrated circuit devices include forming an integrated circuit substrate having an electrically insulating layer thereon and forming a mask layer pattern having at least first and second openings of different size therein, on the electrically insulating layer. First and second p...