Semiconductor device with gate-undercutting recessed region

A semiconductor device comprises a gate structure on a semiconductor substrate and a recessed region in the semiconductor substrate. The recessed region has a widest lateral opening that is near a top surface of the semiconductor substrate. The widest lateral opening undercuts the gate structure.

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Bibliographic Details
Main Authors Pacheco Rotondaro, Antonio Luis, Hurd, Trace Q, Koontz, Elisabeth Marley
Format Patent
LanguageEnglish
Published 01.11.2011
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Abstract A semiconductor device comprises a gate structure on a semiconductor substrate and a recessed region in the semiconductor substrate. The recessed region has a widest lateral opening that is near a top surface of the semiconductor substrate. The widest lateral opening undercuts the gate structure.
AbstractList A semiconductor device comprises a gate structure on a semiconductor substrate and a recessed region in the semiconductor substrate. The recessed region has a widest lateral opening that is near a top surface of the semiconductor substrate. The widest lateral opening undercuts the gate structure.
Author Hurd, Trace Q
Koontz, Elisabeth Marley
Pacheco Rotondaro, Antonio Luis
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  givenname: Elisabeth Marley
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References Keating et al. (2005/0148147) 20050700
Lindert et al. (6946350) 20050900
Bryant et al. (2007/0111417) 20070500
Lee et al. (2005/0045969) 20050300
Forbes (7153753) 20061200
Bohr et al. (2007/0004123) 20070100
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Snippet A semiconductor device comprises a gate structure on a semiconductor substrate and a recessed region in the semiconductor substrate. The recessed region has a...
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Title Semiconductor device with gate-undercutting recessed region
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