Semiconductor device with gate-undercutting recessed region
A semiconductor device comprises a gate structure on a semiconductor substrate and a recessed region in the semiconductor substrate. The recessed region has a widest lateral opening that is near a top surface of the semiconductor substrate. The widest lateral opening undercuts the gate structure.
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
01.11.2011
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Online Access | Get full text |
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Abstract | A semiconductor device comprises a gate structure on a semiconductor substrate and a recessed region in the semiconductor substrate. The recessed region has a widest lateral opening that is near a top surface of the semiconductor substrate. The widest lateral opening undercuts the gate structure. |
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AbstractList | A semiconductor device comprises a gate structure on a semiconductor substrate and a recessed region in the semiconductor substrate. The recessed region has a widest lateral opening that is near a top surface of the semiconductor substrate. The widest lateral opening undercuts the gate structure. |
Author | Hurd, Trace Q Koontz, Elisabeth Marley Pacheco Rotondaro, Antonio Luis |
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References | Keating et al. (2005/0148147) 20050700 Lindert et al. (6946350) 20050900 Bryant et al. (2007/0111417) 20070500 Lee et al. (2005/0045969) 20050300 Forbes (7153753) 20061200 Bohr et al. (2007/0004123) 20070100 |
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Snippet | A semiconductor device comprises a gate structure on a semiconductor substrate and a recessed region in the semiconductor substrate. The recessed region has a... |
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Title | Semiconductor device with gate-undercutting recessed region |
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