Method of manufacturing a piezoelectric vibrator

A method for manufacturing a plurality of piezoelectric vibrators includes forming, in the lid substrate wafer, a plurality of cavity recesses forming a plurality of through-electrodes in and through the base substrate wafer; bonding the plural piezoelectric vibration members to the upper face of th...

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Bibliographic Details
Main Authors Onitsuka, Osamu, Sugama, Kazuyoshi
Format Patent
LanguageEnglish
Published 20.09.2011
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Summary:A method for manufacturing a plurality of piezoelectric vibrators includes forming, in the lid substrate wafer, a plurality of cavity recesses forming a plurality of through-electrodes in and through the base substrate wafer; bonding the plural piezoelectric vibration members to the upper face of the base substrate wafer via routing electrodes; overlaying the base substrate wafer and the lid substrate wafer; bonding the base substrate wafer and the lid substrate wafer; and cutting the two bonded wafers into the plural piezoelectric vibrators. Forming the plurality of through-holes includes disposing electroconductive core members having two flat ends and a thickness substantially equal to that of the base substrate wafer, in the plurality of through-holes, and disposing connection members between the core members and the through-holes; and firing the connection members at a predetermined temperature to integrally fix the through-hole, the connection member and the core member to each other.