Semiconductor chip substrate with multi-capacitor footprint

Various methods and apparatus for coupling capacitors to a chip substrate are disclosed. In one aspect, a method of manufacturing is provided that includes forming a mask on a semiconductor chip substrate that has plural conductor pads. The mask has plural openings that expose selected portions of t...

Full description

Saved in:
Bibliographic Details
Main Authors Li, Yue, Leung, Silqun, Cheung, Terence, Yeung, Sally, Martinez, Liane
Format Patent
LanguageEnglish
Published 06.09.2011
Online AccessGet full text

Cover

More Information
Summary:Various methods and apparatus for coupling capacitors to a chip substrate are disclosed. In one aspect, a method of manufacturing is provided that includes forming a mask on a semiconductor chip substrate that has plural conductor pads. The mask has plural openings that expose selected portions of the plural conductor pads. Each of the plural openings has a footprint corresponding to a footprint of a smallest size terminal of a capacitor adapted to be coupled to the semiconductor chip substrate. A conductor material is placed in the plural openings to establish plural capacitor pads.