Semiconductor device and method of manufacturing the same

Example embodiments are directed to a method of manufacturing a semiconductor device and a semiconductor device including a substrate including a plurality of active regions and a plurality of isolation regions between adjacent active regions, each active region including a groove, a bottom surface...

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Bibliographic Details
Main Authors Joo, Kyung Joong, Kim, Han Soo
Format Patent
LanguageEnglish
Published 06.09.2011
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Summary:Example embodiments are directed to a method of manufacturing a semiconductor device and a semiconductor device including a substrate including a plurality of active regions and a plurality of isolation regions between adjacent active regions, each active region including a groove, a bottom surface of the groove being below an upper surface of the active region.