Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer

A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.

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Bibliographic Details
Main Authors Kroeninger, Werner, Schneegans, Manfred
Format Patent
LanguageEnglish
Published 23.08.2011
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Summary:A method in which a resist layer is applied to a base layer is disclosed. The resist layer includes an adhesive material, and the adhesive force of the adhesive material decreases or increases during an irradiation process. Residues of the resist layer may be stripped using the disclosed method.