Systems and methods to laminate passives onto substrate

A method may include depositing a dielectric layer onto a substrate, removing portions of the dielectric layer to create a plurality of separated non-removed portions of the dielectric layer, depositing one or more passive electronic components into each of the plurality of separated non-removed por...

Full description

Saved in:
Bibliographic Details
Main Authors Seh, Huankiat, Min, Yongki, Salama, Islam A
Format Patent
LanguageEnglish
Published 19.07.2011
Online AccessGet full text

Cover

More Information
Summary:A method may include depositing a dielectric layer onto a substrate, removing portions of the dielectric layer to create a plurality of separated non-removed portions of the dielectric layer, depositing one or more passive electronic components into each of the plurality of separated non-removed portions, and curing the separated non-removed portions of the dielectric layer.