Method and apparatus for packaging circuit devices

A hermetically sealed package includes a lid hermetically bonded to a wafer or substrate, with a chamber therebetween defined by a recess in the lid. A circuit device such as MEMS device is provided within the chamber on the substrate. A plurality of vias (-) are provided through the substrate, and...

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Bibliographic Details
Main Authors Ables, Billy D, Ehmke, John C, Gooch, Roland W
Format Patent
LanguageEnglish
Published 12.07.2011
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Summary:A hermetically sealed package includes a lid hermetically bonded to a wafer or substrate, with a chamber therebetween defined by a recess in the lid. A circuit device such as MEMS device is provided within the chamber on the substrate. A plurality of vias (-) are provided through the substrate, and each have a structure which facilitates a hermetic seal of a suitable level between opposite sides of the substrate. The vias provide electrical communication from externally of the assembly to the device disposed in the chamber.