Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus
A method for forming a multi-layered structure using a droplet-discharging device; the method comprises: (A) forming a first insulating-material layer covering the material-body surface by discharging a droplet of a first insulating material including a first photosensitive resin to a material-body...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
05.07.2011
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Online Access | Get full text |
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Summary: | A method for forming a multi-layered structure using a droplet-discharging device; the method comprises: (A) forming a first insulating-material layer covering the material-body surface by discharging a droplet of a first insulating material including a first photosensitive resin to a material-body surface; (B) obtaining a first insulating layer by curing in the first insulating-material layer; (C) forming a pattern of an electric conductive material layer on the first insulating layer by discharging a droplet of an electric conductive material to the first insulating layer; and (D) forming a wiring pattern on the first insulating layer by activating the pattern of the electric conductive material layer. |
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