Stacked semiconductor chips with separate encapsulations

Stacked semiconductor chips. One embodiment provides a device having a first body. A first power semiconductor chip and first external contact elements is provides. A second body includes a second semiconductor chip and second external contact elements. The second body is placed over the first body....

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Bibliographic Details
Main Authors Otremba, Ralf, Hoeglauer, Josef, Schloegel, Xaver, Tong, Soon Hock, Wong, Kwai Hong
Format Patent
LanguageEnglish
Published 28.06.2011
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Summary:Stacked semiconductor chips. One embodiment provides a device having a first body. A first power semiconductor chip and first external contact elements is provides. A second body includes a second semiconductor chip and second external contact elements. The second body is placed over the first body. The first external contact elements and the second external contact elements define a first plane.