Injection molded solder ball method

Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.

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Bibliographic Details
Main Authors Gruber, Peter A, Hochlowski, Barry A, Naugle, David T
Format Patent
LanguageEnglish
Published 07.06.2011
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Summary:Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.