Silicon wafer etching compositions

A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water, a hydroxide ion source, and a chelating agent. The process produces silicon wafers substantially free from diffused metal ions.

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Bibliographic Details
Main Authors Stinson, Mark G, Erk, Henry F, Zhang, Guoqiang
Format Patent
LanguageEnglish
Published 10.05.2011
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Summary:A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water, a hydroxide ion source, and a chelating agent. The process produces silicon wafers substantially free from diffused metal ions.