Dielectric composition for use in circuitized substrates and circuitized substrate including same

A dielectric composition which is adapted for combining with a supporting material ( e.g., fiber-glass cloth) to form a dielectric layer usable in circuitized such as PCBs, chip carriers and the like. As such a layer, it includes a resin, a predetermined percentage by weight of a filler, and, signif...

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Bibliographic Details
Main Authors Japp, Robert M, Markovich, Voya R, Papathomas, Kostas I
Format Patent
LanguageEnglish
Published 26.04.2011
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Summary:A dielectric composition which is adapted for combining with a supporting material ( e.g., fiber-glass cloth) to form a dielectric layer usable in circuitized such as PCBs, chip carriers and the like. As such a layer, it includes a resin, a predetermined percentage by weight of a filler, and, significantly, only a minor amount of bromine. A circuitized substrate comprised of one or more of these dielectric layers and one or more conductive layers is also provided.