Method for fabricating a clamping device for flexible substrate

A method of fabricating a clamping device for a flexible substrate is provided. A carrier board having a first positing holes and a plurality of second position holes is provided, wherein the first and the second position holes correspond in position to a plurality of through holes on the flexible s...

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Bibliographic Details
Main Authors Wu, Chin-Jyi, Tsai, Chen-Der, Tu, Yun-Chuan, Wong, Te-Chi
Format Patent
LanguageEnglish
Published 19.04.2011
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Summary:A method of fabricating a clamping device for a flexible substrate is provided. A carrier board having a first positing holes and a plurality of second position holes is provided, wherein the first and the second position holes correspond in position to a plurality of through holes on the flexible substrate. A portion of the carrier board material close to the second position holes is removed to form a hole body and a plurality of curved extending arms connected to the hole body and the carrier board. A first dowel pin and a plurality of second dowel pins are provided for inserting into the first positioning hole and the second positioning holes, respectively.