Method of fabricating backside illuminated image sensor

A method for fabricating a backside illuminated image sensor is provided. An exemplary method can include providing a substrate with a front surface and a back surface; forming a first alignment mark for global alignment on the front surface of the substrate; forming a second alignment mark for fine...

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Bibliographic Details
Main Authors Fu, Shih-Chi, Shiau, Gwo-Yuh, Yao, Liang-Lung, Hsieh, Yuan-Chih, Shiu, Feng-Jia
Format Patent
LanguageEnglish
Published 12.04.2011
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Summary:A method for fabricating a backside illuminated image sensor is provided. An exemplary method can include providing a substrate with a front surface and a back surface; forming a first alignment mark for global alignment on the front surface of the substrate; forming a second alignment mark for fine alignment in a clear-out region on the front surface of the substrate; aligning the substrate from the back surface using the first alignment mark; and removing a portion of the back surface of the substrate at the clear-out region for locating the second alignment mark.