Ink ejection device including a silicon chip having a heater stack positioned over a corresponding power transistor

A silicon chip has a plurality of ink jetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interpo...

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Bibliographic Details
Main Authors Guan, Yimin, Rowe, Kristi Maggard, Strunk, Timothy Lowell, Sullivan, Carl Edmond
Format Patent
LanguageEnglish
Published 12.04.2011
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Summary:A silicon chip has a plurality of ink jetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.