Package board and method for manufacturing thereof

A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting...

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Bibliographic Details
Main Authors Cho, Suk-Hyeon, Yoo, Je-Gwang, Lee, Min-Sang, Lee, Seon-Goo, Cho, Han-Seo
Format Patent
LanguageEnglish
Published 08.03.2011
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Summary:A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.