Semiconductor package having passive component and semiconductor memory module including the same

Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting subs...

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Main Authors Bang, Hyo-jae, Lee, Dong-chun, Han, Seong-chan, Kim, Kyung-du, Hwang, Sun-kyu
Format Patent
LanguageEnglish
Published 08.03.2011
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Summary:Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.