Semiconductor apparatus and mobile apparatus

A semiconductor apparatus includes: a wiring board; a first semiconductor device mounted on the wiring board; a second semiconductor device which is stacked on the first semiconductor device and a projection part projects from the outer edge of the first semiconductor device; and a sealing resin lay...

Full description

Saved in:
Bibliographic Details
Main Authors Otsuka, Takeshi, Imaoka, Toshikazu
Format Patent
LanguageEnglish
Published 22.02.2011
Online AccessGet full text

Cover

Loading…
More Information
Summary:A semiconductor apparatus includes: a wiring board; a first semiconductor device mounted on the wiring board; a second semiconductor device which is stacked on the first semiconductor device and a projection part projects from the outer edge of the first semiconductor device; and a sealing resin layer which seals each semiconductor device. And the second semiconductor device has thereon a first analog cell, and a second analog cell which reaches a higher temperature than the first analog cell, and the second analog cell is arranged so as to include the projection part of the second semiconductor device.