Wiring board and method of manufacturing the same

A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and...

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Bibliographic Details
Main Authors Yamano, Takaharu, Sunohara, Masahiro, Iizuka, Hajime, Koyama, Tetsuya
Format Patent
LanguageEnglish
Published 08.02.2011
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Summary:A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.