Method of plating and method of manufacturing a micro device

A method of plating, which allows compositions of plating patterns of a plurality of layers to be uniform without any operational complexity, is provided. The area of the plating layer electrodeposited including plating patterns is constant in each of the plurality of layers. Accordingly, a value of...

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Bibliographic Details
Main Authors Kamijima, Akifumi, Yamaguchi, Atsushi, Saito, Masahiro, Miyata, Shingo, Otsubo, Yuji, Horiuchi, Souhei
Format Patent
LanguageEnglish
Published 21.12.2010
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Summary:A method of plating, which allows compositions of plating patterns of a plurality of layers to be uniform without any operational complexity, is provided. The area of the plating layer electrodeposited including plating patterns is constant in each of the plurality of layers. Accordingly, a value of plating-current density is easily maintained constant without any special operation. Consequently, the plating patterns in each of the plurality of layers is easily formed to have an uniform composition.