Dressing a wafer polishing pad

A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A control...

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Bibliographic Details
Main Authors Stinson, Mark G, Esayanur, Madhavan S, Buese, Dennis, Corsi, Emanuele, Bovio, Ezio, Rinaldi, Antonio Maria, Flannery, Larry
Format Patent
LanguageEnglish
Published 07.12.2010
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Summary:A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.