Semiconductor device and method of manufacturing the same
Example embodiments are directed to a method of manufacturing a semiconductor device and a semiconductor device including a substrate including a plurality of active regions and a plurality of isolation regions between adjacent active regions, each active region including a groove, a bottom surface...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
02.11.2010
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Online Access | Get full text |
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Summary: | Example embodiments are directed to a method of manufacturing a semiconductor device and a semiconductor device including a substrate including a plurality of active regions and a plurality of isolation regions between adjacent active regions, each active region including a groove, a bottom surface of the groove being below an upper surface of the active region. |
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